公开(公告)号：US20200258804A1

公开(公告)日：2020-08-13

申请号：US16858457

申请日：2020-04-24

Applicant: Intel Corporation

Inventor： Aslam HASWAREY ,  Kevin WELLS ,  Mehran ADYANI-YAZDI ,  Daniel R. RUSSELL ,  James C. MOWERY ,  Vinesh LAL ,  Xiangying MA

IPC: H01L23/34 ,  H01L27/02

Abstract: A thermal control circuit is described. The thermal control circuit includes a heating element disposed within an electronic circuit board having a semiconductor chip disposed thereon. The thermal control circuit includes a power management integrated circuit coupled to the heating element. The power management integrated circuit is to enable the heating element to heat the semiconductor chip at least to the semiconductor chips' lowest rated operating temperature prior to the semiconductor chip being placed in a fully operational state.