公开(公告)号：US20220011836A1

公开(公告)日：2022-01-13

申请号：US17484409

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Debra BEYER

IPC: G06F1/20

Abstract: The bandwidth of a memory module is increased by the addition of flow enhancing structure that extends from the top of the memory module into a memory module channel near a memory chip on the memory module operating at a high temperature. The flow enhancing structure disrupts the airflow at that spot, making the airflow more turbulent and faster, which increases the heat transfer from the memory chip operating at the high temperature. The shape and placement of the flow structure in the memory module channel is selected such that that there is a minimal increase in impedance while also having the maximum heat transfer from the memory module operating at the highest temperature.

公开(公告)号：US20240407127A1

公开(公告)日：2024-12-05

申请号：US18805225

申请日：2024-08-14

Applicant: Intel Corporation

Inventor： Douglas HEYMANN ,  Debra BEYER ,  Ameya LIMAYE ,  Mark MACDONALD ,  Sung Ki KIM

IPC: H05K7/20

Abstract: A cooling system includes a cooling fluid bypass to direct cooling fluid around a processor device to a memory module shadowed by the processor device from the cooling fluid flow. The fluid bypass allows the system to direct cooling fluid to the shadowed memory module that has not been used to cool the processor. There are various configurations, allowing the bypassing of different amounts of cooling fluid, allowing system designers to balance a tradeoff between processor heat and memory module heat.