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公开(公告)号：US20190267337A1
公开(公告)日：2019-08-29
申请号：US16348698
申请日：2016-12-29
Applicant: Intel Corporation
Inventor： Vijay K. NAIR , Digvijay Ashokkumar RAORANE
IPC: H01L23/66 , H01L23/48 , H01L23/538 , H01P3/12 , H01P11/00
Abstract: An integrated circuit (IC) comprises a substrate, a first die mounted on the substrate, a second die mounted on the substrate and a waveguide structure mounted on the first die and the second die to enable high frequency wireless communication between the first die and the second die.
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