公开(公告)号：US20250102745A1

公开(公告)日：2025-03-27

申请号：US18475907

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Mohanraj Prabhugoud ,  David Shia ,  Hari Mahalingam ,  John M. Heck ,  John Robert Macdonald ,  Duncan Peter Dore ,  Eric J. M. Moret ,  Nicholas D. Psaila ,  Sang Yup Kim ,  Shane Kevin Yerkes ,  Harel Frish

IPC: G02B6/42

Abstract: In one embodiment, a device includes a fiber array unit (FAU) coupled to a photonics integrated circuit (PIC) die. The PIC die includes a cavity defined at an edge of the PIC die, with outer edges of the cavity being formed at an angle less than 90 degrees with respect to a bottom surface of the cavity. The PIC die further includes first waveguides protruding into the cavity of the PIC die. The FAU includes a shelf portion extending from a body portion, and a plurality of second waveguides protruding from an outer edge of the shelf portion opposite the body portion. The FAU further includes alignment structures on outer edges of the shelf portion that are in contact with the angled edges of the cavity of the PIC die.