公开(公告)号：US20250112206A1

公开(公告)日：2025-04-03

申请号：US18374943

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Eduardo DE MESA ,  Abdallah BACHA ,  Jan PROSCHWITZ ,  Georg SEIDEMANN

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/053 ,  H01L23/538 ,  H01L25/00 ,  H10B80/00

Abstract: Embodiments herein relate to systems, apparatuses, techniques or processes for forming a package that includes a mold compound on a first surface of a redistribution layer, where the mold compound includes one or more cavities, and wherein one or more dies are placed within the cavities. In embodiments, one or more dies may be placed on the second surface of the redistribution layer. In embodiments, the dies, mold compound, and redistribution layer may have different coefficients of thermal expansion, in order to reduce warpage of the package during manufacture and operation. Other embodiments may be described and/or claimed.