公开(公告)号：US20170244208A1

公开(公告)日：2017-08-24

申请号：US15487225

申请日：2017-04-13

Applicant: Intel Corporation

Inventor： Hans-Joachim BARTH ,  Bastiaan ELSHOF ,  Jan PROSCHWITZ

IPC: H01R33/00 ,  H01R13/627 ,  H01R4/64

CPC classification number: H01R33/00 ,  A41D1/005 ,  A44B17/0023 ,  A44B17/0064 ,  H01R4/64 ,  H01R13/627 ,  H01R13/6273 ,  H01R13/6277

Abstract: Embodiments are generally directed to a snap button fastener providing electrical connection. An embodiment of a fastener includes a first mechanical part, the first mechanical part including at least a stud portion, the first mechanical part including a first electrical connector; a second mechanical part, the second mechanical part including at least a socket portion with a spring element and the socket portion, the second mechanical part including a second electrical connector. The stud portion of the first mechanical part and the socket portion of second mechanical part, if separated, are to interlock upon the application of a first force towards each other, and, if interlocked, to separate upon the application of a second force away from each other. The first electrical connector and the second electrical connector are to be electrically connected when the first mechanical part and the mechanical part are interlocked, and first electrical connector and the second electrical connector are to be disconnected when the first mechanical part and second mechanical part are separated.

公开(公告)号：US20250112206A1

公开(公告)日：2025-04-03

申请号：US18374943

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Eduardo DE MESA ,  Abdallah BACHA ,  Jan PROSCHWITZ ,  Georg SEIDEMANN

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/053 ,  H01L23/538 ,  H01L25/00 ,  H10B80/00

Abstract: Embodiments herein relate to systems, apparatuses, techniques or processes for forming a package that includes a mold compound on a first surface of a redistribution layer, where the mold compound includes one or more cavities, and wherein one or more dies are placed within the cavities. In embodiments, one or more dies may be placed on the second surface of the redistribution layer. In embodiments, the dies, mold compound, and redistribution layer may have different coefficients of thermal expansion, in order to reduce warpage of the package during manufacture and operation. Other embodiments may be described and/or claimed.

公开(公告)号：US20210305158A1

公开(公告)日：2021-09-30

申请号：US16833169

申请日：2020-03-27

Applicant: Intel Corporation

Inventor： Thomas WAGNER ,  Jan PROSCHWITZ

IPC: H01L23/528 ,  H01L23/522 ,  H01L23/00 ,  H01L23/552

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a redistribution layer (RDL) having a conductive layer in a first dielectric layer, and a second dielectric layer over the conductive and first dielectric layers. The RDL comprises an extended portion having a first thickness that vertically extends from a bottom surface of the first dielectric layer to a topmost surface of the second dielectric layer. The electronic package comprises a die on the RDL, where the die has sidewall surfaces, a top surface, and a bottom surface that is opposite from the top surface, and an active region on the bottom surface of the die. The first thickness is greater than a second thickness of the RDL that vertically extends from the bottom surface of the first dielectric layer to the bottom surface of the die. The extended portion is over and around the sidewall surfaces.