公开(公告)号：US10825752B2

公开(公告)日：2020-11-03

申请号：US14775487

申请日：2013-06-18

Applicant: Intel Corporation

Inventor： Lei Jiang ,  Edwin B. Ramayya ,  Daniel Pantuso ,  Rafael Rios ,  Kelin J. Kuhn ,  Seiyon Kim

IPC: H01L23/38 ,  H01L21/8238 ,  H01L27/092 ,  H05K1/18

Abstract: Embodiments of the present disclosure describe techniques and configurations for integrated thermoelectric cooling. In one embodiment, a cooling assembly includes a semiconductor substrate, first circuitry disposed on the semiconductor substrate and configured to generate heat when in operation and second circuitry disposed on the semiconductor substrate and configured to remove the heat by thermoelectric cooling. Other embodiments may be described and/or claimed.