公开(公告)号：US20190096833A1

公开(公告)日：2019-03-28

申请号：US15713660

申请日：2017-09-24

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Jiun Hann Sir ,  Eng Huat Eh Goh ,  Mooi Ling Chang

IPC: H01L23/00 ,  H01L23/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/31

Abstract: Substrateless integrated circuit (IC) packages having a die with direct diagonal connections, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC package may include: a die having a face with a plurality of contacts thereon, a dielectric layer in contact with the face, and a conductive pathway extending diagonally through the dielectric layer and coupling to an individual contact of the plurality of contacts on the die. In some embodiments, a conductive pathway may fan out to translate the contacts from a more dense layout to a less dense layout. In some embodiments, a conductive pathway may fan in to translate the contacts from a less dense layout to a more dense layout. In some embodiments, the dielectric layer and the conductive pathway may extend beyond the footprint of the die on one or more edges.

公开(公告)号：US10515912B2

公开(公告)日：2019-12-24

申请号：US15713660

申请日：2017-09-24

Applicant: Intel Corporation

Inventor： Min Suet Lim ,  Jiun Hann Sir ,  Eng Huat Eh Goh ,  Mooi Ling Chang

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/768 ,  H01L23/498 ,  H01L23/31 ,  H01L23/48

Abstract: Substrateless integrated circuit (IC) packages having a die with direct diagonal connections, as well as related structures, devices, and methods, are disclosed herein. For example, in some embodiments, an IC package may include: a die having a face with a plurality of contacts thereon, a dielectric layer in contact with the face, and a conductive pathway extending diagonally through the dielectric layer and coupling to an individual contact of the plurality of contacts on the die. In some embodiments, a conductive pathway may fan out to translate the contacts from a more dense layout to a less dense layout. In some embodiments, a conductive pathway may fan in to translate the contacts from a less dense layout to a more dense layout. In some embodiments, the dielectric layer and the conductive pathway may extend beyond the footprint of the die on one or more edges.