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公开(公告)号：US20240312869A1
公开(公告)日：2024-09-19
申请号：US18183505
申请日：2023-03-14
申请人： Intel Corporation
发明人： Tongyan Zhai , Telesphor Kamgaing , Min Suet Lim
IPC分类号： H01L23/473 , H01L23/00 , H01L23/528
CPC分类号： H01L23/473 , H01L23/528 , H01L24/32 , H01L24/16 , H01L2224/16225 , H01L2224/32225
摘要： Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. A microfluidic cooling layer is formed near a top or front the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices.
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公开(公告)号：US12066833B2
公开(公告)日：2024-08-20
申请号：US17322056
申请日：2021-05-17
申请人： Intel Corporation
CPC分类号： G05D1/0276 , B60W30/00 , G05D1/0231 , G08G1/0116 , H04W4/029 , H04W4/38 , H04W4/44
摘要： The present disclosure may be directed to a computer-assisted or autonomous driving (CA/AD) vehicle that receives a plurality of indications of a condition of one or more features of a plurality of locations of a roadway, respectively, encoded in a plurality of navigation signals broadcast by a plurality of transmitters as the CA/AD vehicle drives past the locations enroute to a destination. The CA/AD vehicle may then determine, based in part on the received indications, driving adjustments to be made and send indications of the driving adjustments to a driving control unit of the CA/AD vehicle.
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3.发明公开公开(公告)号：US20240244772A1
公开(公告)日：2024-07-18
申请号：US18619554
申请日：2024-03-28
申请人： Intel Corporation
发明人： Smit Kapila , Jeff Ku , Min Suet Lim , Sarma Vmk Vedhanabhatla
IPC分类号： H05K5/02
CPC分类号： H05K5/0213
摘要： Techniques are described to dynamically adjust the open air ratio (OAR) while ensuring compliance with regulatory requirements. An adjustable thermal vent assembly is described that dynamically adjusts the OAR for inlet/outlet vents depending on the current use case. The adjustable thermal vent assembly functions to increase the grating spacing only when a triggering condition is met that ensures that a corresponding thermal vent location is inaccessible. Such temporarily inaccessible regions may include the bottom cover of an electronic device when positioned on the surface of an object, for thermal intake vents, or the rear portion of an electronic device when the display cover exceeds a predetermined angle, for thermal exhaust vents.
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公开(公告)号：US11798894B2
公开(公告)日：2023-10-24
申请号：US16451557
申请日：2019-06-25
申请人： Intel Corporation
IPC分类号： H01L21/48 , H01L23/498 , H01L23/00 , H01L23/552
CPC分类号： H01L23/552 , H01L21/481 , H01L21/4846 , H01L23/49838 , H01L24/08 , H01L24/16 , H01L24/73 , H01L2224/16237 , H01L2224/73204 , H01L2224/81203 , H01L2924/3025
摘要： The technique described herein includes a device to address the electrical performance (e.g. signal integrity) degradation ascribed to electromagnetic interference and/or crosstalk coupling occur at tightly coupled (e.g. about 110 μm pitch or less) interconnects, including the first level (e.g. the interconnection between a die and a package substrate). In some embodiments, this invention provides a conductive layer with a plurality of cavities to isolate electromagnetic coupling and/or interference between adjacent interconnects for electronic device performance scaling. In some embodiments, at least one interconnect joint is coupled to the conductive layer, and at least one interconnect joint is isolated from the conductive layer by a dielectric lining at least one of the cavities, the conductive layer being associated to a ground reference voltage by the interconnect joint coupled to the conductive layer.
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公开(公告)号：US11699664B2
公开(公告)日：2023-07-11
申请号：US17089756
申请日：2020-11-05
申请人： Intel Corporation
发明人： Eng Huat Goh , Tin Poay Chuah , Yew San Lim , Min Suet Lim
IPC分类号： H01L23/552 , H05K3/28 , H05K1/02
CPC分类号： H01L23/552 , H05K1/0209 , H05K3/284
摘要： According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.
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公开(公告)号：US20220300692A1
公开(公告)日：2022-09-22
申请号：US17835323
申请日：2022-06-08
申请人： Intel Corporation
发明人： Jin Yan , Adam Norman , Min Suet Lim , Mackenzie Norman , Hong Cheah Ho , Jianfang Zhu , Miaomiao Ma
IPC分类号： G06F30/392 , G06F30/398
摘要： Systems, apparatuses and methods may provide for technology that identifies a plurality of functional blocks in a circuit, wherein each functional block includes a plurality of components, conducts one or more passes of a first optimization loop to determine candidate aspect ratios for the functional blocks based on size data associated with the components, and conducts, within the one or more passes of the first optimization loop, one or more passes of a second optimization loop to determine candidate floorplan data for the circuit based on the candidate aspect ratios.
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公开(公告)号：US20220174820A1
公开(公告)日：2022-06-02
申请号：US17671566
申请日：2022-02-14
申请人： Intel Corporation
发明人： Mooi Ling Chang , Tin Poay Chuah , Eng Huat Goh , Min Suet Lim , Twan Sing Loo
摘要： In one embodiment, a system includes a first circuit defining recesses along an edge of the first circuit board, and a second circuit board defining fins extending from at least one outer edge of the second circuit board. The fins of the second circuit board are positioned within the recesses of the second circuit board to connect the circuit boards in a co-planar manner. The fins and recesses may be shaped to provide an interlocking connection of the first and second circuit boards in the co-planar direction.
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公开(公告)号：US11343906B2
公开(公告)日：2022-05-24
申请号：US16988759
申请日：2020-08-10
申请人： Intel Corporation
发明人： Tai Loong Wong , Fern Nee Tan , Tin Poay Chuah , Min Suet Lim , Siang Yeong Tan
摘要： The present disclosure generally relates to a scalable computer circuit board having a first power level semiconductor package coupled to at least one base-level voltage regulator module, which is coupled to a plurality of connection receptacles that are configured for connecting with a voltage regulator module positioned on a second level, as a standardized base unit. To scale the base unit, a second power level semiconductor package may be exchanged for the first power level semiconductor package in conjunction with one or more voltage regulator module board being positioned over a corresponding number of base-level voltage regulator modules and coupled to their plurality of connection receptacles.
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公开(公告)号：US20210153340A1
公开(公告)日：2021-05-20
申请号：US17127407
申请日：2020-12-18
申请人： Intel Corporation
发明人： Jaejin Lee , James Panakkal , Min Suet Lim , Aiswarya M. Pious
摘要： Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.
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公开(公告)号：US11009890B2
公开(公告)日：2021-05-18
申请号：US16143355
申请日：2018-09-26
申请人： Intel Corporation
摘要： The present disclosure may be directed to a computer-assisted or autonomous driving (CA/AD) vehicle that receives a plurality of indications of a condition of one or more features of a plurality of locations of a roadway, respectively, encoded in a plurality of navigation signals broadcast by a plurality of transmitters as the CA/AD vehicle drives past the locations enroute to a destination. The CA/AD vehicle may then determine, based in part on the received indications, driving adjustments to be made and send indications of the driving adjustments to a driving control unit of the CA/AD vehicle.
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