公开(公告)号：US20250024622A1

公开(公告)日：2025-01-16

申请号：US18897941

申请日：2024-09-26

Applicant: Intel Corporation

Inventor： Richard Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  Garrett Frans Pauwels ,  Emery Evon Frey ,  Steven Adam Klein ,  Daniel Neumann

IPC: H05K7/10 ,  H01R12/57 ,  H01R13/11 ,  H01R13/405

Abstract: Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.