公开(公告)号：US20190057940A1

公开(公告)日：2019-02-21

申请号：US16079534

申请日：2016-03-16

Applicant: Intel Corporation

Inventor： Bok Eng Cheah ,  Hungying Louis Lo

IPC: H01L23/552 ,  H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/31

Abstract: Disclosed herein are stairstep interposers with integrated conductive shields, and related assemblies and techniques. In some embodiments, an interposer may include: an insulating material having a stairstep structure with a first step surface, a second step surface, and a bottom surface to face a package substrate, wherein a first thickness of the insulating material between the first step surface and the bottom surface is greater than a second thickness of the insulating material between the second step surface and the bottom surface; a conductive signal pathway extending from the first step surface to the bottom surface; and a conductive shield disposed within the insulating material to shield the conductive signal pathway.

公开(公告)号：US10748854B2

公开(公告)日：2020-08-18

申请号：US16079534

申请日：2016-03-16

Applicant: Intel Corporation

Inventor： Bok Eng Cheah ,  Hungying Louis Lo

IPC: H01L23/552 ,  H01L25/065 ,  H01L23/60 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L25/00 ,  H01L23/29 ,  H01L25/10 ,  H01L25/18

Abstract: Disclosed herein are stairstep interposers with integrated conductive shields, and related assemblies and techniques. In some embodiments, an interposer may include: an insulating material having a stairstep structure with a first step surface, a second step surface, and a bottom surface to face a package substrate, wherein a first thickness of the insulating material between the first step surface and the bottom surface is greater than a second thickness of the insulating material between the second step surface and the bottom surface; a conductive signal pathway extending from the first step surface to the bottom surface; and a conductive shield disposed within the insulating material to shield the conductive signal pathway.