公开(公告)号：US20250132264A1

公开(公告)日：2025-04-24

申请号：US19005018

申请日：2024-12-30

Applicant: Intel Corporation

Inventor： Huong Thu Do ,  Nicholas Steven Haehn ,  Brandon Christian Marin ,  Mitchell Ian Page ,  Erhan Atci

IPC: H01L23/538 ,  H01L23/15 ,  H01L25/18 ,  H10D1/20

Abstract: Glass cores with embedded power delivery components are disclosed. An example apparatus includes a glass layer including an opening, a dielectric material within the opening, a first cluster of inductors extending through the dielectric material, and a second cluster of inductors extending through the dielectric material, the second cluster spaced apart from the first cluster, the dielectric material extending continuously from around the first cluster to around the second cluster.