公开(公告)号：US20250132264A1

公开(公告)日：2025-04-24

申请号：US19005018

申请日：2024-12-30

Applicant: Intel Corporation

Inventor： Huong Thu Do ,  Nicholas Steven Haehn ,  Brandon Christian Marin ,  Mitchell Ian Page ,  Erhan Atci

IPC: H01L23/538 ,  H01L23/15 ,  H01L25/18 ,  H10D1/20

Abstract: Glass cores with embedded power delivery components are disclosed. An example apparatus includes a glass layer including an opening, a dielectric material within the opening, a first cluster of inductors extending through the dielectric material, and a second cluster of inductors extending through the dielectric material, the second cluster spaced apart from the first cluster, the dielectric material extending continuously from around the first cluster to around the second cluster.

公开(公告)号：US20240355758A1

公开(公告)日：2024-10-24

申请号：US18756926

申请日：2024-06-27

Applicant: Intel Corporation

Inventor： Steven Adam Klein ,  Jason Gamba ,  Matthew Thomas Guzy ,  Nicholas Steven Haehn ,  Tarek Adly Ibrahim ,  Brandon Christian Marin ,  Srinivas Venkata Ramanuja Pietambaram ,  Jacob John Schichtel

IPC: H01L23/544 ,  H01L23/15 ,  H01L23/40

CPC classification number: H01L23/544 ,  H01L23/15 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/54426

Abstract: Systems, apparatus, articles of manufacture, and methods to reduce stress between sockets and associated integrated circuit packages having glass cores are disclosed. An example integrated circuit package includes: a semiconductor die, and a substrate including a glass core. The substrate includes a first surface, a second surface opposite the first surface, and a third surface between the first surface and the second surfaces. The first surface supports the semiconductor die. The second surface includes first contacts to electrical couple with second contacts in a socket. At least a portion of the third surface separated and distinct from the glass core.