公开(公告)号：US20230369211A1

公开(公告)日：2023-11-16

申请号：US17743954

申请日：2022-05-13

Applicant: Intel Corporation

Inventor： Clifford J. ENGEL ,  Robert L. BRISTOL ,  Richard H. LIVENGOOD ,  Ilan RONEN ,  Kevin Lai LIN

IPC: H01L23/528

CPC classification number: H01L23/5283

Abstract: Lithographic methodologies involving, and apparatuses suitable for, inline circuit edits are described. In an example, an integrated circuit structure includes a plurality of conductive structures along corresponding ones of a plurality of line tracks along a first direction. The integrated circuit structure also includes a white space track included within the plurality of line tracks, the white space track having a width along a second direction greater than a width of an individual one of the plurality of line tracks, the second direction orthogonal to the first direction. A conductive structure is along the white space track.