公开(公告)号：US20240407092A1

公开(公告)日：2024-12-05

申请号：US18806367

申请日：2024-08-15

Applicant: Intel Corporation

Inventor： Ariatne Ramirez Macias ,  Allison Van Horn ,  Kristin L. Weldon ,  Israel Cruz Ruiz ,  Fernando Gonzalez Lenero ,  Min Pei ,  Francisco Javier Colorado Alonso ,  Randall Scott Sanford ,  Emery Evon Frey ,  Eric W. Buddrius

IPC: H05K1/11

Abstract: Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover relative to the socket; and a handle to facilitate positioning of the cover to move the cutout into engagement with the pin.