公开(公告)号：US20240407092A1

公开(公告)日：2024-12-05

申请号：US18806367

申请日：2024-08-15

Applicant: Intel Corporation

Inventor： Ariatne Ramirez Macias ,  Allison Van Horn ,  Kristin L. Weldon ,  Israel Cruz Ruiz ,  Fernando Gonzalez Lenero ,  Min Pei ,  Francisco Javier Colorado Alonso ,  Randall Scott Sanford ,  Emery Evon Frey ,  Eric W. Buddrius

IPC: H05K1/11

Abstract: Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover relative to the socket; and a handle to facilitate positioning of the cover to move the cutout into engagement with the pin.

公开(公告)号：US20250055217A1

公开(公告)日：2025-02-13

申请号：US18929426

申请日：2024-10-28

Applicant: Intel Corporation

Inventor： Min Pei ,  Lejie Liu ,  Ralph Miele ,  Phil Geng ,  Steven Klein

IPC: H01R13/24 ,  H01R12/71

Abstract: A Land Grid Array (LGA) interface assembly used to physically interface or connect a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) and a PCB, motherboard, etc. The LGA interface assembly including an LGA socket including a plurality of socket pins arranged and configured to contact a plurality of contact pads on the semiconductor package to enable data transfer. The socket pins including a multi-bend and/or zig-zag configuration arranged and configured to minimize lateral displacement of the socket pin relative to the contact pad during insertion of the semiconductor package into the LGA socket. Other embodiments are described and claimed.

公开(公告)号：US20230014898A1

公开(公告)日：2023-01-19

申请号：US17955210

申请日：2022-09-28

Applicant: Intel Corporation

Inventor： Phil Geng ,  Jordan Johnson ,  Mengqi Liu ,  Ralph Miele ,  Min Pei

IPC: H01R12/70 ,  H01R12/82 ,  H01R43/26 ,  H05K7/14

Abstract: Methods, apparatus, systems, and articles of manufacture to improve pin contact are disclosed. An apparatus disclosed herein includes a back plate, a circuit board disposed between the back plate and a socket, and a spring sheet disposed between the back plate and the circuit board.

公开(公告)号：US20240413054A1

公开(公告)日：2024-12-12

申请号：US18810136

申请日：2024-08-20

Applicant: Intel Corporation

Inventor： Min Pei ,  Ralph V. Miele ,  Lejie Liu ,  Phil Geng ,  Caleb Million Tessema

IPC: H01L23/467 ,  H01L23/367 ,  H01L23/40

Abstract: Integrated circuit packages with fluid spacers to improve pin load distribution are disclosed. An example apparatus includes an integrated circuit (IC) package, a circuit board, a socket to couple the IC package and the circuit board, a backplate coupled to the circuit board, a loading assembly to provide a stack load to the IC package, and a fluid liner positioned between the circuit board and the backplate.