公开(公告)号：US10757790B2

公开(公告)日：2020-08-25

申请号：US15179867

申请日：2016-06-10

Applicant: Intel Corporation

Inventor： Sandhiprakash J. Bhide ,  Sheldon L. Sun ,  James Bigler ,  Christopher T. Sauvageau ,  Henry Bruce

IPC: G06F17/00 ,  H05B47/12 ,  H04R1/02 ,  H05B47/11 ,  H05B47/105 ,  H04R1/04

Abstract: Apparatuses, methods and a storage medium associated with a sensor hub are disclosed herein. In embodiments, a sensor hub may include a body with a plurality of apertures disposed on the sensor hub body at substantially equal distances to each other, oriented towards a plurality of directions, and a plurality of sensors disposed inside the sensor hub body to interface respective apertures, to sense ambient conditions in the plurality of directions via the apertures. The sensor hub may further include one or more communication interfaces to transmit the sensor data or results from processing the sensor data to an external recipient. Other embodiments may be described and claimed.

公开(公告)号：US20170359664A1

公开(公告)日：2017-12-14

申请号：US15179867

申请日：2016-06-10

Applicant: Intel Corporation

Inventor： Sandhiprakash J. Bhide ,  Sheldon L. Sun ,  James Bigler ,  Christopher T. Sauvageau ,  Henry Bruce

IPC: H04R29/00 ,  G01J1/42 ,  H05B37/02

Abstract: Apparatuses, methods and a storage medium associated with a sensor hub are disclosed herein. In embodiments, a sensor hub may include a body with a plurality of apertures disposed on the sensor hub body at substantially equal distances to each other, oriented towards a plurality of directions, and a plurality of sensors disposed inside the sensor hub body to interface respective apertures, to sense ambient conditions in the plurality of directions via the apertures. The sensor hub may further include one or more communication interfaces to transmit the sensor data or results from processing the sensor data to an external recipient. Other embodiments may be described and claimed.