公开(公告)号：US12216158B2

公开(公告)日：2025-02-04

申请号：US17102891

申请日：2020-11-24

Applicant: Intel Corporation

Inventor： Jeremy Hicks ,  Hari Mahalingam ,  Christopher Seibert ,  Eric Snow ,  Harel Frish

IPC: G01R31/311 ,  G02B6/30 ,  G02B6/42

Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.

公开(公告)号：US20220163583A1

公开(公告)日：2022-05-26

申请号：US17102891

申请日：2020-11-24

Applicant: Intel Corporation

Inventor： Jeremy Hicks ,  Hari Mahalingam ,  Christopher Seibert ,  Eric Snow ,  Harel Frish

IPC: G01R31/311 ,  G02B6/42

Abstract: Systems and methods for testing a photonic IC (PIC) with an optical probe having an out-of-plane edge coupler to convey test signals between the out-of-plane probe and an edge coupled photonic waveguide within a plane of the PIC. To accommodate dimensions of the optical probe, a test trench may be fabricated in the PIC near an edge coupler of the waveguide. The optical probe may be displaced along one or more axes relative to a prober to position a free end of the prober within the test trench and to align the probe's out-of-plane edge coupler with an edge coupler of a PIC waveguide. Accordingly, a PIC may be probed at the wafer-level, without first dicing a wafer into PIC chips or bars. The optical probe may be physically coupled to a prober through a contact sensor to detect and/or avoid physical contact between probe and PIC.