公开(公告)号：US20210043580A1

公开(公告)日：2021-02-11

申请号：US17078897

申请日：2020-10-23

Applicant: Intel Corporation

Inventor： Jesse C. JONES ,  Gang DUAN ,  Jason GAMBA ,  Yosuke KANAOKA ,  Rahul N. MANEPALLI ,  Vishal SHAJAN

IPC: H01L23/544 ,  H01L23/538 ,  H01L21/762

Abstract: An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.