公开(公告)号：US10347615B2

公开(公告)日：2019-07-09

申请号：US15554144

申请日：2015-03-24

Applicant: Intel Corporation

Inventor： Myung Jin Yim ,  Jay S. Lee ,  Jong-Min Hong

IPC: H01L25/16 ,  H01L23/538 ,  H01L23/00

Abstract: Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.

公开(公告)号：US20180047713A1

公开(公告)日：2018-02-15

申请号：US15554144

申请日：2015-03-24

Applicant: Intel Corporation

Inventor： Myung Jin Yim ,  Jay S. Lee ,  Jong-Min Hong

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/167 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/96 ,  H01L2924/14 ,  H01L2924/18162 ,  Y02E10/52

Abstract: Some forms include an electronic package that includes a photo-detecting receiver IC and a receiver IC. The electronic package includes a mold that encloses the photo-detecting receiver IC and the receiver IC. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching one another. Other forms include an optical module that includes a substrate and an electronic package mounted on the substrate. The electronic package includes a photo-detecting receiver IC and a receiver IC that are enclosed within a mold. The photo-detecting receiver IC and the receiver IC are adjacent to one another without touching. Other forms include a method that includes forming a mold that includes a photo-detecting receiver IC and a receiver IC that are adjacent to one another without touching. The photo-detecting receiver IC includes optical components that are exposed on a surface of the mold.