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公开(公告)号：US20240419883A1
公开(公告)日：2024-12-19
申请号：US18209434
申请日：2023-06-13
Applicant: Intel Corporation
Inventor： Lei JIANG , Daniel CHRISTENSEN , Daniel PANTUSO , Kambiz KOMEYLI , Jeffrey HICKS , Manjunath SHAMANNA
IPC: G06F30/392 , G06F30/394
Abstract: Disclosed is an integrated circuit with a metallization stack that has thermal tower assemblages formed from wires in two or more metal layers to assist in dissipating heat out of the metallization stack.
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