公开(公告)号：US20200035658A1

公开(公告)日：2020-01-30

申请号：US16049696

申请日：2018-07-30

Applicant: Intel Corporation

Inventor： Kumar Abhishek SINGH ,  Zhaozhi LI ,  Thomas J. DEBONIS ,  Robert NICKERSON ,  Rees WINTERS

IPC: H01L25/18 ,  H01L23/31 ,  H01L21/56 ,  H01L25/00 ,  H01L21/48 ,  H01L23/544

Abstract: Embodiments disclosed herein include an electronics package. In an embodiment, the electronics package comprises a package substrate and a die on the package substrate. In an embodiment, a mold layer is positioned over the package substrate. In an embodiment, the electronics package further comprises through-mold interconnects through the mold layer, and a trench that extends at least partially into the mold layer.