公开(公告)号：US20230204856A1

公开(公告)日：2023-06-29

申请号：US17561648

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Eredzhep MENUMEROV ,  LU CHENG ,  Boping XIE

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/1203 ,  G02B6/12019 ,  G02B2006/12102 ,  G02B2006/12121 ,  G02B2006/12135

Abstract: A semiconductor photonic package can include a laser module and a photonic integrated circuit (PIC), each having a different operating temperature. The two modules are placed on a common substrate allowing accurate optical alignment. In addition, a thermal barrier is integrated into the substrate between the laser module and the PIC to provide thermal stability, especially to the laser module. The substrate can include a housing with good electrical conductivity or an optical substrate and housing. The thermal barrier is integrated into the optical substrate, the housing, or both. The thermal barrier in the optical substrate can be a cutout that does not divide the optical substrate into two separate pieces.