公开(公告)号：US20230204856A1

公开(公告)日：2023-06-29

申请号：US17561648

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Eredzhep MENUMEROV ,  LU CHENG ,  Boping XIE

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/1203 ,  G02B6/12019 ,  G02B2006/12102 ,  G02B2006/12121 ,  G02B2006/12135

Abstract: A semiconductor photonic package can include a laser module and a photonic integrated circuit (PIC), each having a different operating temperature. The two modules are placed on a common substrate allowing accurate optical alignment. In addition, a thermal barrier is integrated into the substrate between the laser module and the PIC to provide thermal stability, especially to the laser module. The substrate can include a housing with good electrical conductivity or an optical substrate and housing. The thermal barrier is integrated into the optical substrate, the housing, or both. The thermal barrier in the optical substrate can be a cutout that does not divide the optical substrate into two separate pieces.

公开(公告)号：US20240069287A1

公开(公告)日：2024-02-29

申请号：US18271791

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Vinod ADIVARAHAN ,  Liqiang CUI ,  Aditi MALLIK ,  Boping XIE ,  Sunil PRIYADARSHI

IPC: G02B6/36

CPC classification number: G02B6/3636

Abstract: A fiber array unit (200) and a photonics system (890), a fiber array unit (200) comprises a substrate (205) with a first el end and a second end. A first mesa (207) is adjacent to the first end and a second mesa (209) is adjacent to the second end. A v-groove (211) is in the first mesa (207) and a slot (213) is in the second mesa (209). The v-groove (211) is aligned with the slot (213).

公开(公告)号：US20230318247A1

公开(公告)日：2023-10-05

申请号：US17710881

申请日：2022-03-31

Applicant: INTEL cORPORATION

Inventor： Eleanor Patricia Paras RABADAM ,  Guiyun BAI ,  Sanjeev GUPTA ,  Ronald SPREITZER ,  Jonathan DOYLEND ,  Ankur AGRAWAL ,  Boping XIE ,  Sushrutha Reddy GUJJULA ,  Jason GARCIA ,  Kenneth BROWN ,  Dan WANG ,  Daniel GRODENSKY ,  Israel PETRONIUS ,  Konstantin MATYUCH

IPC: H01S3/04

CPC classification number: H01S3/0405

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to a package that includes multiple PICs in the package that are optically coupled with each other. In embodiments, the package may include discrete electronic and optical components, and thermal management solutions for co-packaging of multiple PICs. Other embodiments may be described and/or claimed.

公开(公告)号：US20210210478A1

公开(公告)日：2021-07-08

申请号：US17191615

申请日：2021-03-03

Applicant: Intel Corporation

Inventor： Susheel JADHAV ,  Juan DOMINGUEZ ,  Ankur AGRAWAL ,  Kenneth BROWN ,  Yi LI ,  Jing CHEN ,  Aditi MALLIK ,  Xiaoyu HONG ,  Thomas LILJEBERG ,  Andrew C. ALDUINO ,  Ling LIAO ,  David HUI ,  Ren-Kang CHIOU ,  Harinadh POTLURI ,  Hari MAHALINGAM ,  Lobna KAMYAB ,  Sasanka KANUPARTHI ,  Sushrutha Reddy GUJJULA ,  Saeed FATHOLOLOUMI ,  Priyanka DOBRIYAL ,  Boping XIE ,  Abiola AWUJOOLA ,  Vladimir TAMARKIN ,  Keith MEASE ,  Stephen KEELE ,  David SCHWEITZER ,  Brent ROTHERMEL ,  Ning TANG ,  Suresh POTHUKUCHI ,  Srikant NEKKANTY ,  Zhichao ZHANG ,  Kaiyuan ZENG ,  Baikuan WANG ,  Donald TRAN ,  Ravindranath MAHAJAN ,  Baris BICEN ,  Grant SMITH

IPC: H01L25/18 ,  H01L23/473 ,  H01R12/71

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.