公开(公告)号：US20220217846A1

公开(公告)日：2022-07-07

申请号：US17700972

申请日：2022-03-22

Applicant: Intel Corporation

Inventor： Xiang Li ,  Konika Ganguly ,  George Vergis ,  Stephen Christianson ,  Xiaopeng Dong ,  Landon Hanks

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18

Abstract: An embodiment of an electronic apparatus comprises a circuit board, one or more memory devices affixed to a top side of the circuit board, and one or more board-to-board connectors affixed to a bottom side of the circuit board to provide an external connection to signals of the one or more memory devices, where the one or more board-to-board connectors are located inward from outermost edges of the circuit board and where a first footprint defined by an outermost boundary of the one or more board-to-board connectors is substantially a same size as or smaller than a second footprint defined by an outermost boundary of the one or more memory devices. Other embodiments are disclosed and claimed.