公开(公告)号：US20210098350A1

公开(公告)日：2021-04-01

申请号：US16888155

申请日：2020-05-29

Applicant: Intel Corporation

Inventor： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Kooi Chi Ooi ,  Lee Fueng Yap ,  Chan Kim Lee

IPC: H01L23/498 ,  H01L25/16 ,  H01L25/18 ,  H05K1/18

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.

公开(公告)号：US11482481B2

公开(公告)日：2022-10-25

申请号：US16888155

申请日：2020-05-29

Applicant: Intel Corporation

Inventor： Bok Eng Cheah ,  Jackson Chung Peng Kong ,  Kooi Chi Ooi ,  Lee Fueng Yap ,  Chan Kim Lee

IPC: H05K1/18 ,  H01L23/498 ,  H01L25/16 ,  H01L25/18

Abstract: An electronic device is disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.