公开(公告)号：US20250089156A1

公开(公告)日：2025-03-13

申请号：US18367963

申请日：2023-09-13

Applicant: Intel Corporation

Inventor： Mohamed R. SABER ,  Manohar KONCHADY ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Hiroki TANAKA ,  Gang DUAN

IPC: H05K1/02 ,  H01L23/15 ,  H01L23/498 ,  H05K1/03 ,  H05K1/11

Abstract: Embodiments disclosed herein include an apparatus with a glass core and a via. In an embodiment, the apparatus comprises a layer, where the layer is a solid layer of glass. An opening is provided through the layer, and a via is in the opening. The via comprises a first material, where the first material comprises at least one metallic element, and a second material, where the second material comprises carbon.