公开(公告)号：US20240274521A1

公开(公告)日：2024-08-15

申请号：US18570455

申请日：2021-12-15

Applicant: Intel Corporation

Inventor： Chenghai Yan ,  Lei Wang ,  Maoxin Yin ,  Wenzhi Wang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/66

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L23/66 ,  H01L24/14 ,  H01L24/16 ,  H01L2223/6661 ,  H01L2224/1403 ,  H01L2224/16227

Abstract: Methods, apparatus, systems, and articles of manufacture to reduce impedance discontinuities and crosstalk in integrated circuit packages are disclosed. A disclosed apparatus includes: a package substrate, and a ball grid array on a first surface of the package substrate. The ball grid array includes a first ball and a second ball adjacent the first ball. The ball grid array is to enable the package substrate to be electrically coupled to a circuit board. The apparatus further includes a metal interconnect within the package substrate. The metal interconnect is electrically coupled to the first ball. The metal interconnect includes an inductive loop that extends toward the second ball.