公开(公告)号：US20250105148A1

公开(公告)日：2025-03-27

申请号：US18372970

申请日：2023-09-26

Applicant: Intel Corporation

Inventor： Marvin PAIK ,  June CHOI ,  Shao Ming KOH ,  Supanee SUKRITTANON ,  Ananya DUTTA ,  Sudipto NASKAR

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/532

Abstract: Embodiments of the disclosure are in the field of integrated circuit structure fabrication. In an example, an integrated circuit structure includes a plurality of conductive lines on a same level and along a same direction, a first one of the plurality of conductive lines having a first width and a first composition, and a second one of the plurality of conductive lines having a second width and a second composition. The second width greater than the first width, and the second composition is different than the first composition. The second one of the plurality of conductive lines has an uppermost surface above an uppermost surface of the first one of the plurality of conductive lines.