公开(公告)号：US20250105148A1

公开(公告)日：2025-03-27

申请号：US18372970

申请日：2023-09-26

Applicant: Intel Corporation

Inventor： Marvin PAIK ,  June CHOI ,  Shao Ming KOH ,  Supanee SUKRITTANON ,  Ananya DUTTA ,  Sudipto NASKAR

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/532

Abstract: Embodiments of the disclosure are in the field of integrated circuit structure fabrication. In an example, an integrated circuit structure includes a plurality of conductive lines on a same level and along a same direction, a first one of the plurality of conductive lines having a first width and a first composition, and a second one of the plurality of conductive lines having a second width and a second composition. The second width greater than the first width, and the second composition is different than the first composition. The second one of the plurality of conductive lines has an uppermost surface above an uppermost surface of the first one of the plurality of conductive lines.

公开(公告)号：US20230420512A1

公开(公告)日：2023-12-28

申请号：US17850778

申请日：2022-06-27

Applicant: Intel Corporation

Inventor： Sukru YEMENICIOGLU ,  Xinning WANG ,  Nischal ARKALI RADHAKRISHNA ,  Leonard P. GULER ,  Mauro J. KOBRINSKY ,  June CHOI ,  Pratik PATEL ,  Tahir GHANI

IPC: H01L29/06 ,  H01L27/088 ,  H01L29/423 ,  H01L29/786 ,  H01L23/48 ,  H01L29/775

CPC classification number: H01L29/0673 ,  H01L27/0886 ,  H01L29/775 ,  H01L29/78696 ,  H01L23/481 ,  H01L29/42392

Abstract: Integrated circuit structures having backside power staple are described. In an example, an integrated circuit structure includes a plurality of gate lines. A plurality of trench contacts is extending over a plurality of source or drain structures, individual ones of the plurality of trench contacts alternating with individual ones of the plurality of gate lines. A front-side metal routing layer is extending over one or more of the plurality of gate lines, and over and coupled to one or more of the plurality of trench contacts. A backside metal routing layer is extending beneath the one or more of the plurality of gate lines and the one or more of the plurality of trench contacts, the backside metal routing layer parallel and overlapping with the front-side metal routing layer. A conductive feedthrough structure couples the backside metal routing layer to the front-side metal routing layer.