公开(公告)号：US11935860B2

公开(公告)日：2024-03-19

申请号：US16828651

申请日：2020-03-24

Applicant: Intel Corporation

Inventor： Morten Jensen ,  Michael Ryan ,  Srikant Nekkanty ,  Joe F. Walczyk

IPC: H01L23/00 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01L24/32 ,  H01L24/67 ,  H01R12/714 ,  H01R13/2421 ,  H01R13/2485 ,  H01R13/2492

Abstract: An interconnect that has an electrically conductive layer, where a first and second insulator layers are coupled with the conductive layer. A region of the conductive layer includes an opening of a portion of the first insulator layer the second insulator layer that are adjacent to the region. An electrical connector of a first device is electrically coupled to a portion of the region on a first side of the conductive layer and an electrical conductor of a second device is electrically coupled with a portion of the region on the second side. Also, an interconnect coupled with a substrate that includes a cylinder extending from a side of the substrate with a plate coupled at the end of the cylinder with an opening that includes two or more tabs of the plate extending into the opening to receive a connector.