公开(公告)号：US10579963B2

公开(公告)日：2020-03-03

申请号：US15719075

申请日：2017-09-28

Applicant: Intel Corporation

Inventor： Addicam Sanjay ,  Narendra Patel ,  Shao-Wen Yang ,  Jose Avalos

IPC: G06Q10/08 ,  G06K7/10 ,  G06K17/00 ,  G01S5/02 ,  G06K19/077 ,  H04L29/08 ,  H04W4/80 ,  G06N20/00

Abstract: An embodiment of a semiconductor package apparatus may include technology to associate an asset to a fixture with a device positioned proximate to the fixture, and determine a location of the fixture based on a location of the device. Other embodiments are disclosed and claimed. Non-limiting example applications may include shipping, logistics, warehouse asset tracking, retail, etc.

公开(公告)号：US20190095852A1

公开(公告)日：2019-03-28

申请号：US15719075

申请日：2017-09-28

Applicant: Intel Corporation

Inventor： Addicam Sanjay ,  Narendra Patel ,  Shao-Wen Yang ,  Jose Avalos

IPC: G06Q10/08 ,  G06K7/10 ,  G06K17/00

Abstract: An embodiment of a semiconductor package apparatus may include technology to associate an asset to a fixture with a device positioned proximate to the fixture, and determine a location of the fixture based on a location of the device. Other embodiments are disclosed and claimed. Non-limiting example applications may include shipping, logistics, warehouse asset tracking, retail, etc.