公开(公告)号：US20240184274A1

公开(公告)日：2024-06-06

申请号：US18060576

申请日：2022-12-01

Applicant: Intel Corporation

Inventor： Mohammad Mamunur RAHMAN ,  Omesh TICKOO ,  Nilesh AHUJA ,  Ergin U GENC ,  Julianne TROIANO ,  Ibrahima NDIOUR

IPC: G05B19/418

CPC classification number: G05B19/4184 ,  G05B19/41885 ,  H05K3/00

Abstract: A method for identifying a tool anomaly of an printed circuit board (PCB) manufacturing process comprising a plurality of phases, the method comprising the steps of: obtaining image data of at least one tool of the PCB manufacturing process; inputting the image data to a machine learning module, the machine learning module configured to perform the following steps: extracting, from the image data, a tool feature image data of the at least one tool; classifying the image data into a phase of the plurality of phases; and determining, based on the classified image data and the tool feature image data, an anomaly state of the at least one tool.

公开(公告)号：US20210279506A1

公开(公告)日：2021-09-09

申请号：US17191718

申请日：2021-03-04

Applicant: Intel Corporation

Inventor： Parual DATTA ,  Nilesh AHUJA ,  Javier FELIP LEON

IPC: G06K9/62 ,  G06K9/00

Abstract: Estimating a head pose may include obtaining sensor data corresponding to a head and at least a portion of the body of a human subject and determining an estimate of a three-dimensional (3D) body pose using the obtained sensor data. The estimation can further include generating a first rendering of at least the human subject's head using the obtained sensor data and generating a plurality of head pose sample data sets by applying the estimated 3D body pose to a head-pose generative model. Further, the head pose estimation can include generating a plurality of second renderings respectively from each of the plurality of head pose sample data sets; determining which of the plurality of second renderings is closest to the first rendering; and selecting the second rendering determined to be closest to the first rendering.