公开(公告)号：US20210329811A1

公开(公告)日：2021-10-21

申请号：US17359134

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Mark MacDonald ,  Akhilesh Rallabandi ,  Ellann Cohen ,  Michael Nakanishi ,  John Carver ,  Arturo Navarro Alvarez ,  Oleg Krishcko

IPC: H05K7/20

Abstract: Sub-ambient cooling systems with condensation mitigation for use with electronic devices are disclosed. An example sub-ambient cooling assembly disclosed herein includes a heat spreader to remove heat from an electronic component. A thermal electric cooler that is to remove heat from the heat spreader. A heat exchanger to remove heat from the thermal electric cooler, where the thermal electric cooler is positioned between the heat spreader and the heat exchanger. A shroud is to at least partially surround the heat spreader and the thermal electric cooler, where the heat exchanger is to transfer heat to the shroud to increase a surface temperature of the shroud.