公开(公告)号：US20240371777A1

公开(公告)日：2024-11-07

申请号：US18141887

申请日：2023-05-01

Applicant: Intel Corporation

Inventor： Arijit KOLEY ,  Ashish BHATIA ,  Wayne M. LYTLE ,  Stephen SUDIRGO ,  Nora BERG ,  Patrick WHITING ,  Michael MUSORRAFITI ,  Olawale Taiwo OLADEINDE ,  Emily TIMMINS ,  Beatrice MURIUNGI ,  Matthew TAYLOR

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: Embodiments disclosed herein include an interposer. In an embodiment, the interposer comprises a substrate with a first surface and a second surface opposite from the first surface. In an embodiment, a via is provided through the substrate, where a portion of the via extends past the second surface. In an embodiment, a first layer is over the substrate, where the first layer is an electrically insulating material. In an embodiment, a second layer is over the first layer and over the portion of the via that extends past the second surface.