公开(公告)号：US10340101B2

公开(公告)日：2019-07-02

申请号：US15749393

申请日：2016-04-02

Applicant: Intel Corporation

Inventor： Reji Varghese ,  Ayeshwarya B. Mahajan ,  Peter Bonesio ,  Ramesh Pendakur ,  Sukanya Sundaresan

IPC: H01H13/83 ,  H01H13/79 ,  A61B5/0402 ,  A61B5/053 ,  A61B5/00 ,  G06F3/023 ,  H01H13/705 ,  H01H3/12 ,  H01H13/704 ,  H01H13/7065

Abstract: Particular embodiments described herein provide for a keycap. The keycap can include a protective layer and an active element, where the height of protective layer and the active element is less than six (6) millimeters in height. The keycap can also include a front plane layer, a back plane layer, where the front plane layer and the back plane layer comprise the active element, and an electrical connection through the keycap to provide electrical communication with the active element.

公开(公告)号：US20180226210A1

公开(公告)日：2018-08-09

申请号：US15749393

申请日：2016-04-02

Applicant: Intel Corporation

Inventor： Reji Varghese ,  Ayeshwarya B. Mahajan ,  Peter Bonesio ,  Ramesh Pendakur ,  Sukanya Sundaresan

IPC: H01H13/83 ,  H01H13/704 ,  H01H13/7065

CPC classification number: H01H13/83 ,  A61B5/0402 ,  A61B5/0537 ,  A61B5/6897 ,  A61B5/6898 ,  G06F3/0233 ,  G06F3/0238 ,  H01H3/125 ,  H01H13/704 ,  H01H13/705 ,  H01H13/7065 ,  H01H13/79 ,  H01H2203/038 ,  H01H2219/002 ,  H01H2219/01 ,  H01H2219/012 ,  H01H2219/02 ,  H01H2227/026

Abstract: Particular embodiments described herein provide for a keycap. The keycap can include a protective layer and an active element, where the height of protective layer and the active element is less than six (6) millimeters in height. The keycap can also include a front plane layer, a back plane layer, where the front plane layer and the back plane layer comprise the active element, and an electrical connection through the keycap to provide electrical communication with the active element.