-
公开(公告)号:US20250105132A1
公开(公告)日:2025-03-27
申请号:US18373095
申请日:2023-09-26
Applicant: Intel Corporation
Abstract: Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a substrate that is a solid glass layer, and an opening through a thickness of the substrate. In an embodiment, a via structure is in the opening, where the via structure comprises a first region with an electrically conductive material with a first porosity, and a second region in contact with the first region, where the second region comprises an electrically conductive material with a second porosity that is less than the first porosity. In an embodiment, the second region is separated from a sidewall of the opening by the first region.