公开(公告)号：US20250105132A1

公开(公告)日：2025-03-27

申请号：US18373095

申请日：2023-09-26

Applicant: Intel Corporation

Inventor： Pratyush MISHRA ,  Pratyasha MOHAPATRA ,  Srinivas Venkata Ramanuja PIETAMBARAM

IPC: H01L23/498 ,  H01L23/15 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11

Abstract: Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a substrate that is a solid glass layer, and an opening through a thickness of the substrate. In an embodiment, a via structure is in the opening, where the via structure comprises a first region with an electrically conductive material with a first porosity, and a second region in contact with the first region, where the second region comprises an electrically conductive material with a second porosity that is less than the first porosity. In an embodiment, the second region is separated from a sidewall of the opening by the first region.