公开(公告)号：US20200212012A1

公开(公告)日：2020-07-02

申请号：US16639085

申请日：2017-09-30

Applicant: Intel Corporation

Inventor： Preston T. MEYERS ,  Javier A. FALCON ,  Shawna M. LIFF ,  Joe R. SAUCEDO ,  Adel A. ELSHERBINI ,  Albert S. LOPEZ ,  Johanna M. SWAN

IPC: H01L25/065 ,  H01L25/00

Abstract: A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates.