公开(公告)号：US09618973B2

公开(公告)日：2017-04-11

申请号：US14752695

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Remi Bergmann ,  Erkki Nokkonen ,  Juha Paavola ,  Hannu Luoma ,  Kari Vallius

IPC: G06F1/16 ,  H05B3/00 ,  B32B7/00 ,  H05B3/86 ,  B32B7/12 ,  B32B7/06

CPC classification number: H05B3/0014 ,  B32B3/08 ,  B32B3/263 ,  B32B7/06 ,  B32B7/12 ,  B32B2250/44 ,  B32B2307/75 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2519/00 ,  B32B2605/08 ,  G06F1/1613 ,  H05B3/86

Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.

公开(公告)号：US20160378140A1

公开(公告)日：2016-12-29

申请号：US14752695

申请日：2015-06-26

Applicant: Intel Corporation

Inventor： Remi Bergmann ,  Erkki Nokkonen ,  Juha Paavola ,  Hannu Luoma ,  Kari Vallius

IPC: G06F1/16 ,  H05B3/86 ,  H05B3/00

CPC classification number: H05B3/0014 ,  B32B3/08 ,  B32B3/263 ,  B32B7/06 ,  B32B7/12 ,  B32B2250/44 ,  B32B2307/75 ,  B32B2457/00 ,  B32B2457/20 ,  B32B2519/00 ,  B32B2605/08 ,  G06F1/1613 ,  H05B3/86

Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.

Abstract translation: 描述了关于提供和/或利用机械嵌入式加热元件的方法和装置。 一个实施例包括与粘合剂热耦合的加热元件。 粘合剂粘合第一项和第二项。 加热元件能够响应于功率的应用而被加热，并且加热的加热元件通过粘合剂释放粘合以允许第一物品和第二物品的物理分离。 还公开并要求保护其他实施例。