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公开(公告)号:US20180097394A1
公开(公告)日:2018-04-05
申请号:US15283344
申请日:2016-10-01
Applicant: Intel Corporation
Inventor: Saku Lahti , Mikko S. Komulainen , Erkki Nokkonen
Abstract: A wireless charging system and a method for tuning the wireless charging system is described. The system can include matching circuitry coupled to a transmission coil and a controller coupled to the matching circuitry. The transmission coil can have a load inductance. The controller can control the matching circuitry to adjust a voltage associated with the capacitance value based on the load inductance to cause the voltage associated with the capacitance value and a current associated with the capacitance value to be in phase.
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公开(公告)号:US10389159B2
公开(公告)日:2019-08-20
申请号:US15283344
申请日:2016-10-01
Applicant: Intel Corporation
Inventor: Saku Lahti , Mikko S. Komulainen , Erkki Nokkonen
Abstract: A wireless charging system and a method for tuning the wireless charging system is described. The system can include matching circuitry coupled to a transmission coil and a controller coupled to the matching circuitry. The transmission coil can have a load inductance. The controller can control the matching circuitry to adjust a voltage associated with the capacitance value based on the load inductance to cause the voltage associated with the capacitance value and a current associated with the capacitance value to be in phase.
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公开(公告)号:US20160378140A1
公开(公告)日:2016-12-29
申请号:US14752695
申请日:2015-06-26
Applicant: Intel Corporation
Inventor: Remi Bergmann , Erkki Nokkonen , Juha Paavola , Hannu Luoma , Kari Vallius
CPC classification number: H05B3/0014 , B32B3/08 , B32B3/263 , B32B7/06 , B32B7/12 , B32B2250/44 , B32B2307/75 , B32B2457/00 , B32B2457/20 , B32B2519/00 , B32B2605/08 , G06F1/1613 , H05B3/86
Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.
Abstract translation: 描述了关于提供和/或利用机械嵌入式加热元件的方法和装置。 一个实施例包括与粘合剂热耦合的加热元件。 粘合剂粘合第一项和第二项。 加热元件能够响应于功率的应用而被加热,并且加热的加热元件通过粘合剂释放粘合以允许第一物品和第二物品的物理分离。 还公开并要求保护其他实施例。
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公开(公告)号:US20170077734A1
公开(公告)日:2017-03-16
申请号:US14854509
申请日:2015-09-15
Applicant: Intel Corporation
Inventor: Erkki Nokkonen , Jaakko Isohella
Abstract: An apparatus for power transmission with a wireless transceiver is described herein. The apparatus can include a power supply to generate a voltage and a current to flow through a power multiplexer and to a tuning antenna resonator. In this disclosure, the power multiplexer can switch between a receive mode and a transmit mode based on a signal from the processor. The tuning antenna resonator can transmit and receive power based on the power multiplexer.
Abstract translation: 本文描述了一种具有无线收发器的功率传输装置。 该装置可以包括电源以产生电流和电流流过功率多路复用器和调谐天线谐振器。 在本公开中,功率复用器可以基于来自处理器的信号在接收模式和发射模式之间切换。 调谐天线谐振器可以基于功率多路复用器发送和接收功率。
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公开(公告)号:US09491345B2
公开(公告)日:2016-11-08
申请号:US14229554
申请日:2014-03-28
Applicant: INTEL CORPORATION
Inventor: Erkki Nokkonen
CPC classification number: H04N5/2256 , G01K7/00 , G03B15/05 , H04N5/23241 , H04N5/2354 , H05B33/0848 , H05B33/0854
Abstract: A method may be provided that includes sensing a temperature, determining a current of a flash device based on the sensed temperature, and operating the flash device based on the determined current to provide light.
Abstract translation: 可以提供一种方法,其包括感测温度,基于感测的温度确定闪光灯装置的电流,以及基于所确定的电流来操作闪光装置以提供光。
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公开(公告)号:US09618973B2
公开(公告)日:2017-04-11
申请号:US14752695
申请日:2015-06-26
Applicant: Intel Corporation
Inventor: Remi Bergmann , Erkki Nokkonen , Juha Paavola , Hannu Luoma , Kari Vallius
CPC classification number: H05B3/0014 , B32B3/08 , B32B3/263 , B32B7/06 , B32B7/12 , B32B2250/44 , B32B2307/75 , B32B2457/00 , B32B2457/20 , B32B2519/00 , B32B2605/08 , G06F1/1613 , H05B3/86
Abstract: Methods and apparatus relating to provision and/or utilization of a mechanically embedded heating element are described. An embodiment includes a heating element which is thermally coupled to an adhesive. The adhesive bonds a first item and a second item. The heating element is capable of being heated in response to application of power and the heated heating element causes the release of a bond by the adhesive to allow for physical separation of the first item and the second item. Other embodiments are also disclosed and claimed.
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