公开(公告)号：US11100023B2

公开(公告)日：2021-08-24

申请号：US15718178

申请日：2017-09-28

Applicant: Intel Corporation

Inventor： Ruirui Huang ,  Nilanjan Palit ,  Robert P. Adler ,  Ioannis T. Schoinas ,  Avishay Snir ,  Boris Dolgunov

IPC: G06F13/40 ,  H04L12/741 ,  G06F15/78 ,  H04L29/06

Abstract: In one example, a semiconductor die includes a plurality of agents and a fabric coupled to at least some of the plurality of agents. The fabric may include at least one router to provide communication between two or more of the plurality of agents, the at least one router coupled to a first agent of the plurality of agents, where the first agent is to send a first message to the at least one router, the first message comprising a first header including a first source identifier, and the at least one router is to validate that the first source identifier is associated with the first agent and if so to direct the first message towards a destination agent, and otherwise to prevent the first message from being directed towards the destination agent. Other embodiments are described and claimed.