公开(公告)号：US20180191061A1

公开(公告)日：2018-07-05

申请号：US15474541

申请日：2017-03-30

Applicant: Intel Corporation

Inventor： Arvind Sundaram ,  Vikas Mishra ,  Ramaswamy Parthasarathy ,  Sandesh G K.

IPC: H01Q1/38 ,  H05K1/02 ,  H05K3/46 ,  H05K3/18 ,  H01Q13/02

CPC classification number: H05K3/4611 ,  H01P3/10 ,  H01Q13/02 ,  H05K1/0243 ,  H05K3/403 ,  H05K3/4638 ,  H05K3/4697 ,  H05K2203/167

Abstract: An apparatus comprises a multi-layer printed circuit board (PCB) including a plurality of board layers arranged between a top surface of the PCB and a bottom surface of the PCB; and a surface wave launcher for a single-wire transmission line arranged below the top surface of the PCB and above the bottom surface of the PCB.