公开(公告)号：US20210286667A1

公开(公告)日：2021-09-16

申请号：US17332302

申请日：2021-05-27

Applicant: Intel Corporation

Inventor： Theodros Yigzaw ,  John Holm ,  Subhankar Panda ,  Hugo Enrique Gonzalez Chavero ,  Satyaprakash Nanda ,  Omar Avelar Suarez ,  Guarav Porwal

IPC: G06F11/07

Abstract: An embodiment of an electronic apparatus may comprise one or more substrates, and a controller coupled to the one or more substrates, the controller including circuitry to provide management of a connected hardware subsystem with respect to one or more of reliability, availability and serviceability, and coordinate the management of the connected hardware subsystem with respect to one or more of reliability, availability and serviceability between the connected hardware subsystem and a host. Other embodiments are disclosed and claimed.

公开(公告)号：US12189468B2

公开(公告)日：2025-01-07

申请号：US17332302

申请日：2021-05-27

Applicant: Intel Corporation

Inventor： Theodros Yigzaw ,  John Holm ,  Subhankar Panda ,  Hugo Enrique Gonzalez Chavero ,  Satyaprakash Nanda ,  Omar Avelar Suarez ,  Guarav Porwal

IPC: G06F11/07

Abstract: An embodiment of an electronic apparatus may comprise one or more substrates, and a controller coupled to the one or more substrates, the controller including circuitry to provide management of a connected hardware subsystem with respect to one or more of reliability, availability and serviceability, and coordinate the management of the connected hardware subsystem with respect to one or more of reliability, availability and serviceability between the connected hardware subsystem and a host. Other embodiments are disclosed and claimed.