公开(公告)号：US20190099777A1

公开(公告)日：2019-04-04

申请号：US15720655

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Ken P. Hackenberg ,  Nachiket R. Raravikar ,  James C. Matayabas, JR. ,  Elizabeth Nofen ,  Seth B. Reynolds ,  Amram Eitan ,  Nisha Ananthakrishnan

IPC: B05C5/02 ,  B05C11/10

Abstract: A fluid applicator configured to apply a fluid to at least one substrate feature includes a manifold plate having an inflow orifice and a manifold reservoir. A distributor plate is coupled with the manifold plate. The distributor plate includes a distributor surface extending across the manifold reservoir, and a distributor port array spread across the distributor surface and in communication with the manifold reservoir. A compressible reticulated media is configured for applying the fluid to the at least one substrate feature. The compressible reticulated media includes an input interface coupled along the distributor surface, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the substrate interface.