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    INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP PACKAGES
    2.
    发明申请
    INTEGRATED HEAT SPREADER WITH ENHANCED VAPOR CHAMBER FOR MULTICHIP PACKAGES 审中-公开

    公开(公告)号：US20200350229A1

    公开(公告)日：2020-11-05

    申请号：US16398452

    申请日：2019-04-30

    Applicant: Intel Corporation

    Inventor： Je-Young Chang ,  James C. Matayabas, JR. ,  Zhimin Wan ,  Kyle Arrington

    IPC: H01L23/473 ,  H01L23/373 ,  H01L23/367 ,  H05K7/20

    Abstract: An integrated circuit package includes a first die and second die above a substrate, and a vapor chamber above at least one of the first and second die. A vapor space within the vapor chamber is separated into at least a first section and a second section. The first section may be over the first die, and the second section may be over the second die, for example. The structure separating the first and second sections at least partly restricts flow of vapor between the first and second sections, thereby preventing or reducing thermal cross talk between the first and second dies. In some cases, an anisotropic thermal material is above one of the first or second die, wherein the anisotropic thermal material has substantially higher thermal conductivity in a direction of a heat sink than a thermal conductivity in a direction of a section of the vapor chamber.

    COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME
    8.
    发明申请
    COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME 审中-公开

    公开(公告)号：US20190099777A1

    公开(公告)日：2019-04-04

    申请号：US15720655

    申请日：2017-09-29

    Applicant: Intel Corporation

    Inventor： Ken P. Hackenberg ,  Nachiket R. Raravikar ,  James C. Matayabas, JR. ,  Elizabeth Nofen ,  Seth B. Reynolds ,  Amram Eitan ,  Nisha Ananthakrishnan

    IPC: B05C5/02 ,  B05C11/10

    Abstract: A fluid applicator configured to apply a fluid to at least one substrate feature includes a manifold plate having an inflow orifice and a manifold reservoir. A distributor plate is coupled with the manifold plate. The distributor plate includes a distributor surface extending across the manifold reservoir, and a distributor port array spread across the distributor surface and in communication with the manifold reservoir. A compressible reticulated media is configured for applying the fluid to the at least one substrate feature. The compressible reticulated media includes an input interface coupled along the distributor surface, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the substrate interface.

    PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
    9.
    发明申请
    PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE 审中-公开

    公开(公告)号：US20180286704A1

    公开(公告)日：2018-10-04

    申请号：US15477053

    申请日：2017-04-01

    Applicant: Intel Corporation

    Inventor： Elizabeth M. Nofen ,  Arjun Krishnan ,  James C. Matayabas, JR. ,  Venmathy McMahan ,  Nisha Ananthakrishnan ,  Yonghao Xiu

    IPC: H01L21/56 ,  H01L21/66 ,  H01L21/67 ,  H01L21/782 ,  H01L21/82

    Abstract: A process for applying an underfill material to a die is disclosed. A wafer is diced into a plurality of dies (without having any underfill film thereon) such that the dies have exposed bumps prior to an underfill process. Thus, the dies can be tested about their bump-sides because the bumps are entirely exposed for testing. The dies are then reconstituted bump-side up on a carrier panel in an array such that the dies are separated from each other by a gap. Underfill material (e.g., epoxy flux film) is then vacuum laminated to the carrier panel and the plurality of dies to encapsulate the dies. The underfill material is then cut between adjacent dies such that a portion of the underfill material covers at least one side edge of each die. The encapsulated dies are then removed from the carrier panel, thereby being prepared for a thermal bonding process to a substrate. Associated devices are provided.

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