公开(公告)号：US20190006549A1

公开(公告)日：2019-01-03

申请号：US16074758

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Myung Jin YIM ,  Seungjae LEE ,  Sandeep RAZDAN

IPC: H01L31/12 ,  H01L23/498 ,  H01L25/16 ,  H01L33/62 ,  H01L23/367 ,  H01L33/58

Abstract: Optoelectronic device modules having a silicon photonics transmitter die connected to a silicon interposer are described. In an example, the optoelectronic device module includes a silicon photonics transmitter die connected to a silicon interposer, and the silicon interposer is disposed between the silicon photonics transmitter die and a substrate. The silicon interposer provides an electrical interconnect between the silicon photonics transmitter die and the substrate, and reduces a likelihood that a hybrid silicon laser on the silicon photonics transmitter die will be damaged during module operation.