公开(公告)号：US20250102740A1

公开(公告)日：2025-03-27

申请号：US18373851

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Harel FRISH ,  Hari MAHALINGAM ,  Saeed FATHOLOLOUMI ,  Shane YERKES ,  John HECK ,  Wei QIAN

IPC: G02B6/36

Abstract: A device comprising a silicon substrate and a waveguide on the silicon substrate. A groove is in the substrate, the groove having a sloped rear wall adjacent to the waveguide. A trench is in the substrate, the trench along a second direction generally orthogonal to the first direction across the sloped rear wall, the trench having a vertical wall at an intersection with the sloped rear wall. An optical fiber in the groove with one end of the optical fiber abutting the vertical wall.