公开(公告)号：US20230318211A1

公开(公告)日：2023-10-05

申请号：US18130404

申请日：2023-04-03

Applicant: Intel Corporation

Inventor： Xiang Li ,  Shaohua Li ,  Jingbo Li ,  Mo Liu ,  Kai Xiao ,  Kai Wang

IPC: H01R12/72 ,  H01R13/52 ,  H01R4/02

CPC classification number: H01R12/721 ,  H01R13/5219 ,  H01R13/5216 ,  H01R4/023 ,  H05K7/20236

Abstract: Methods and apparatus relating to liquid-proof edge connector solutions for immersion cooling are described. In one embodiment, a seal prevents a cooling liquid to cause electrical contact with a pin of an edge card to be inserted in a connector. And, an adhesive prevents the cooling liquid to cause electrical contact with a terminal of the connector. Other embodiments are also claimed and disclosed.

公开(公告)号：US20210203094A1

公开(公告)日：2021-07-01

申请号：US17202961

申请日：2021-03-16

Applicant: Intel Corporation

Inventor： Xiang Li ,  Mo Liu ,  Shaohua Li ,  Jingbo Li ,  Kai Xiao

IPC: H01R12/73 ,  H01R12/57 ,  H01R12/72 ,  H01R13/26 ,  H05K1/18

Abstract: In one embodiment, a card edge connector includes: a housing having an opening into which a first circuit board is to be inserted; a plurality of pins each having a first end and a second end, the plurality of pins extending from within the opening through a bottom surface of the housing, the first end of the first plurality of pins to mate with a corresponding contact of the first circuit board; and a plurality of ball grid array (BGA) solder balls each adapted at the second end of a corresponding one of the plurality of pins, the plurality of pins to mate with a corresponding conductive area of a second circuit board to which the card edge connector mates via the plurality of BGA solder balls. Other embodiments are described and claimed.

公开(公告)号：US20220021139A1

公开(公告)日：2022-01-20

申请号：US17483913

申请日：2021-09-24

Applicant: Intel Corporation

Inventor： Xiang Li ,  Shaohua Li ,  Kai Xiao ,  Mo Liu ,  Jingbo Li

IPC: H01R12/57 ,  H01R12/72 ,  H01R12/73

Abstract: In one embodiment, a card edge connector includes a housing including a slot to receive a first circuit board. A first plurality of pins extend from within the slot through a bottom of the housing. Each of the first plurality of pins includes a first end to mate with a corresponding contact of the first circuit board and a second end to mate with a corresponding one of a first plurality of contacts of a second circuit board, the second end including a heel portion and a toe portion extending from the heel portion in a direction away from a centerline of the slot. A second plurality of pins extend from within the slot through the bottom of the housing. Each of the second plurality of pins includes a first end to mate with a corresponding contact of the first circuit board and a second end to mate with a corresponding one of a second plurality of contacts of the second circuit board, the second end comprising a heel portion and a toe portion extending from the heel portion in a direction toward the centerline of the slot. Other embodiments are described and claimed.