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公开(公告)号：US20230100829A1
公开(公告)日：2023-03-30
申请号：US18070361
申请日：2022-11-28
Applicant: Intel Corporation
Inventor： Sheue Fen Yong , Archanna Srinivasan , Graham Baker , Pheak Ti Teh
IPC: H01L25/065 , H01L23/00 , H01L23/538 , H01L25/00
Abstract: An integrated circuit package includes a first integrated circuit die, a spacer die coupled in the integrated circuit package in a location designed to house a second integrated circuit die, and a package substrate coupled to the first integrated circuit die and to the spacer die.
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