公开(公告)号：US20230204878A1

公开(公告)日：2023-06-29

申请号：US17560847

申请日：2021-12-23

Applicant: Intel Corporation

Inventor： Wesley B. Morgan ,  Sufi R. Ahmed ,  Vineeth Abraham ,  Sivakumar Yagnamurthy ,  Xiaoqian Li ,  Srikant Nekkanty

IPC: G02B6/42

CPC classification number: G02B6/4212 ,  G02B6/4239 ,  G02B6/4243

Abstract: A receptacle of a photonics package, a receptacle assembly including the receptacle, the photonics package, and a method of making the receptacle assembly. The receptacle assembly comprises: a photonics integrated circuit (PIC) including waveguides thereon; a die side lens assembly; and a rigid receptacle body including: a plug portion to receive an optical plug that includes a plug side lens assembly; a lens portion supporting the die side lens assembly and configured such that the die side lens assembly and the plug side lens assembly are aligned to one another when the optical plug is received in the plug portion; and a PIC portion bonded to the PIC such that the waveguides of the PIC are aligned to: corresponding lenses of the die side lens assembly; and corresponding lenses of the plug side lens assembly when the optical plug is received in the plug portion.